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• Single-channel, 1024-/256-position resolution
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• 20 kΩ, 50 kΩ, 100 kΩ nominal resistance
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• Maximum ±1% nominal resistor tolerance error
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• 50-times programmable (50-TP) wiper memory
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• Rheostat mode temperature coefficient: 5 ppm/°C
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• 2.7 V to 5.5 V single-supply operation
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•2.5 V to ±2.75 V dual-supply operation for ac or bipolar operations
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• I
2C-compatible interface
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• Wiper setting readback
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• Power on refreshed from 50-TP memory
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•Thin LFCSP 10-lead, 3 mm × 3 mm × 0.8 mm package
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•Compact MSOP, 10-lead 3 mm × 4.9 mm × 1.1 mm package
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| CATALOG |
| AD5272BRMZ-50 COUNTRY OF ORIGIN |
AD5272BRMZ-50 PARAMETRIC INFO
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AD5272BRMZ-50 PACKAGE INFO
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AD5272BRMZ-50 MANUFACTURING INFO
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AD5272BRMZ-50 PACKAGING INFO
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AD5272BRMZ-50 ECAD MODELS
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AD5272BRMZ-50 FUNCTIONAL BLOCK DIAGRAM
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AD5272BRMZ-50 APPLICATIONS
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COUNTRY OF ORIGIN
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| Malaysia |
Philippines
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|
PARAMETRIC INFO
|
| Resistance Value (KOhm) |
50 |
| Number of Positions |
1024 |
| Number of Pot per Package |
1 |
| Memory Type |
Non-Volatile |
| Taper Type |
Linear |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Extended Industrial |
| Power Supply Type |
Single|Dual |
| Maximum Dual Supply Voltage (V) |
±2.75 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Maximum Supply Current (mA) |
0.001 |
| Minimum Dual Supply Voltage (V) |
±2.5 |
| Minimum Single Supply Voltage (V) |
2.7 |
| Typical Single Supply Voltage (V) |
5 |
| Control Interface |
Serial (2-Wire, I2C) |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
|
|
PACKAGE INFO
|
| Supplier Package |
MSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
10 |
| Lead Shape |
Gull-wing |
| PCB |
10 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.85 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
4.9 |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Micro Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187BA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging |
Tube |
| Quantity Of Packaging |
50 |
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ECAD MODELS
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FUNCTIONAL BLOCK DIAGRAM
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| APPLICATION |
• Mechanical rheostat replacements
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• Op-amp: variable gain control
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• Instrumentation: gain, offset adjustment
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• Programmable voltage to current conversions
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• Programmable filters, delays, time constants
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| • Programmable power supply |
• Sensor calibration
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| |
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