KSZ8061RNDW-TR Microchip Technology IC TXRX ETHERNET 100MBPS 32QFN

label:
2025/01/8 27
KSZ8061RNDW-TR Microchip Technology 	IC TXRX ETHERNET 100MBPS 32QFN


CATALOG
KSZ8061RNDW-TR PARAMETRIC INFO
KSZ8061RNDW-TR PACKAGE INFO
KSZ8061RNDW-TR MANUFACTURING INFO
KSZ8061RNDW-TR PACKAGING INFO
KSZ8061RNDW-TR ECAD MODELS
KSZ8061RNDW-TR APPLICATIONS


PARAMETRIC INFO
Type Ethernet Transceiver
Maximum Data Rate 100Mbps
Number of Channels per Chip 2
PHY Line Side Interface No
JTAG Support No
Standard Supported 10BASE-T|100BASE-TX
Typical Data Rate (Mbps) 10/100
Integrated CDR No
Number of Transceivers 1
Overhead Octet Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 105
Process Technology CMOS
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -55
Typical Operating Supply Voltage (V) 3.3
Minimum Operating Supply Voltage (V) 3.135
Maximum Operating Supply Voltage (V) 3.465
Operating Supply Voltage (V) 3.3


PACKAGE INFO
Supplier Package VQFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 32
Lead Shape No Lead
PCB 32
Tab N/R
Package Length (mm) 5
Package Width (mm) 5
Package Height (mm) 0.83
Package Diameter (mm) N/R
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Very Thin Quad Flat No Lead Package, Exposed Pad
Package Family Name QFN
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 1000


ECAD MODELS



APPLICATIONS
• Industrial Control
• Vehicle On-Board Diagnostics (OBD)
• Automotive Gateways
• Camera and Sensor Networking
• Infotainment
Product RFQ