PIC16F677-I/SO Microchip Technology IC MCU 8BIT 3.5KB FLASH 20SOIC

label:
2023/10/25 173


CATALOG
PIC16F677-I/SO COUNTRY OF ORIGIN
PIC16F677-I/SO PARAMETRIC INFO
PIC16F677-I/SO PACKAGE INFO
PIC16F677-I/SO MANUFACTURING INFO
PIC16F677-I/SO PACKAGING INFO
PIC16F677-I/SO ECAD MODELS


COUNTRY OF ORIGIN
Thailand


PARAMETRIC INFO
Data Bus Width (bit) 8
Family Name PIC16
Device Core PIC
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 20
Program Memory Type Flash
Program Memory Size 3.5KB
RAM Size 128B
Maximum Expanded Memory Size 14KB
Direct Memory Access No
Floating Point Unit No
Bluetooth No
Wi-Fi No
Multiply Accumulate No
Internal/External Clock Type Internal/External
Touch Sensing Interface No
Power On Reset No
Memory Protection Unit No
Temperature Sensor Yes
DDR No
Memory Management Unit No
Integrated Development Environment Yes
Super Scalar No
External Bus Interface No
Maximum CPU Frequency (MHz) 20
Number of Programmable I/Os 17
Number of Timers 2
ADC Channels 12
ADC Resolution (bit) 10
Core Architecture PIC
Number of ADCs Single
PWM 1
Watchdog 1
Analog Comparators 2
Parallel Master Port No
Real Time Clock No
Interface Type I2C/SPI
Programmability Yes
SPI 1
I2C 1
I2S 0
UART 0
USART 0
CAN 0
USB 0
Ethernet 0
Maximum Power Dissipation (mW) 800
Minimum Operating Supply Voltage (V) 4.5
Typical Operating Supply Voltage (V) 5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
 
PACKAGE INFO
Supplier Package SOIC W
Basic Package Type Lead-Frame SMT
Pin Count 20
Lead Shape Gull-wing
PCB 20
Tab N/R
Package Length (mm) 12.8
Package Width (mm) 7.5
Package Height (mm) 2.05(Min)
Package Diameter (mm) N/R
Mounting Surface Mount
Package Description Small Outline IC Wide Body
Package Family Name SO
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
 
PACKAGING INFO
Packaging Tube
Quantity Of Packaging 38
 
ECAD MODELS


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